澳洲幸运10全天一期计划

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When you engage Minco early in the design cycle, our team of highly trained engineers can introduce design insights that help reduce risk, minimize cost and increase solution reliability. Our proprietary New Product Introduction (NPI) approach allows for upfront design and manufacture analysis, followed by a process risk analysis step to promote fewer product iterations and minimize delays.

澳洲幸运10最准的计划

 Description Rigid Flex
Multilayer, Dbl Layer
& Single Layer
HDI
Min. drilled via finished dia. .008" .008" n/a
Min. laser via formed dia. .003 .003" 75μm
Min. line and spacing .003"/.003"
.003"/.003" 50μm /50μm
Min. copper thickness
9 Micron
9 Micron
9 Micron
Max copper thickness
< 2 oz
< 4oz < 1oz
Min. pad size for thru-hole vias
Via dia. + .015"
Via dia. + .015"
n/a
Min. pad size for micro vias
N/A Via dia. + .006
Via dia. + .006
Panel Size
18" by 24"
18" by 24"
18" by 24"
Thru hole plating aspect ratio
10:1 10:1 4:1
Blind micro via min. plating aspect ratio
- 1:1 1:1
Panel plating
yes yes
yes
Selective plating
yes yes
yes
Number of layers
12+ 1-10 2-6
Via fill
Copper filled
Copper filled
Copper filled

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